Chain Wire Bonding of a RF SOE Package Using a Gold Ball Bonder

Chain bonding is a cost-effective alternative to wedge bonding for RF-SOE power transistors, providing comparable performance.

RF-SOE power transistors are traditionally wire bonded using gold wedge bonders to create strings of loops with each loop in the chain having specific length and height requirements.

A ball bond technology (chain bonding) to create a ball-loop-stitch-loop-stitch-loop-stitch … is demonstrated as a more cost effective alternative to these traditional wedge bond solutions.

Initial chain bonding using a ball bonder produced comparable performance as a wedge bonded solution, but used more prevalent ball bonding technology to reduce interconnect cost of ownership.

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