Equipment for Advanced Packaging

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As an enabling technology, automated microelectronic and photonic manufacturing equipment is the engine that propels today's product concepts from the laboratory into large-scale commercial, military and industrial prominence. Wafer fabrication equipment is driven by widely standardized feature-width silicon technology nodes and wafer sizes. Assembly and packaging equipment, especially in the realm of advanced packaging, is driven by specific packaging formats that are not standardized. In the leading edge of the market, emerging packaging methods and novel materials provide the impetus for innovative packaging and interconnection processes and equipment.


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