Introduction to Automated Flip Chip Assembly

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The flip chip process avoids the need for wire bonding and, therefore, attributes to much smaller device packaging than wire bonded counterparts.

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face down. The connection is made through conductive bumps placed on the surface of the die.

Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate. This connection provides thermal conduction through the two materials as well as acts as a "spacer" to provide mechanical
support and electrical conductivity.

Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.

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