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Epoxy die attach is the most commonly used die attach process.
It is a more cost-effective solution in comparison to eutectic die attach, mainly because of material costs and process.
Common epoxy die attach applications include simple transistors, encapsulation of wire bonds, LED attachment, MCMs and complex hybrids.
The growing popularity of hybrid microcircuits is partially due to their built-in flexibility and small package size. Aerospace and defense, medical and optoelectronic device manufacturers have integrated the hybrid package in order to achieve multiple-need and multi-performance requirements. With rapid time-to-market needs, automating the packaging process becomes necessary.
Epoxy die attach is a consistent, reliable form of component attach. Automated epoxy dispense systems have kept up with these advances by maintaining a high level of control, handling and sophisticated process control software. The epoxy must be controlled to provide good substrate, component, and die coverage.
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