Automated Assembly Tool for Precision, High-Speed RF Die Attach Applications

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As telecommunications and information processing have exploded over the several decades, the need for extremely accurate, high-yield microchip assembly solutions has shifted from a low volume aerospace and defense industry niche to a broad, high volume commercial market encompassing multiple industries. From palmtops to telecommunication switches, the chip industry is witnessing an insatiable requirement for more and more accurate devices at ever increasing and more cost-effective production rates.

The keys to responding to this challenge are improved hardware and software to enable greater speeds without sacrificing precision, increased automation to eliminate error-prone human handling during processing, and greater integration to create a seamless, integrated assembly platform -- complete process solutions coupled with agile automation.

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Automated Assembly Tool for Precision High-Speed RF Die Attach Applications


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