A solid investment in a die bonder designed to grow as production grows
Carlsbad, CA – Sept 15, 2021 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their new Palomar 3880-II Die Bonder. The new Palomar 3880-II Die Bonder is based on Palomar’s proven 3880 Die Bonder design but now includes options to even further
“We are excited to launch this upgraded version of our long-standing, flexible die bonder. The new Palomar 3880-II Die Bonder builds upon the proven engineering of our previous bonders in the Palomar family, the Palomar 3500, 3800 and 3880 Die Bonders,” said Rich Hueners, Vice President of Sales and Marketing for Palomar Technologies. “Users of the 3880-II can expect the same unparalleled flexibility in the 3880-II with support for eutectic, epoxy, solder paste, inspection, tracking, sorting, all in one machine that can continually scale up in automation and volume. It represents a solid investment for all customers from R&D up to volume, automated bonding.”
The Palomar 3880-II Die Bonder maximizes productivity with a number of improvements, including:
Additionally, the 3880-II can reduce programming time by up to 95% with:
The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications by providing a large work envelope with an open platform for hardware mounting. Typical applications for the Palomar 3880-II Die Bonder include:
|
|
For more information on the Palomar 3880-II Die Bonder, visit: Palomar 3880-II Die Bonder. Also, register for Palomar’s webinar: A Solid Investment for Maximizing Productivity - The Palomar 3880-II Die Bonder scheduled for October 20, 2021 at 8 am PDT.
Media Contact:
Rebecca Janzon
Global Corporate Communications Director
Email: rjanzon@bonders.com
Mobile: 760-409-7453
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for Datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and China. For more information, visit: http://www.palomartechnologies.com