3880-II Die Bonder
Download the Brochure!A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II die bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications.
Applications
- AOC - Active optical cable
- Chip-on-board
- CMOS sensors
- GaN/GaAs MMIC
- HB/HP LED assembly
- HPLD (high power laser diode)
- Hybrid microcircuits
- LiDAR
- Medical semiconductor & sensors
- MEMS / MOEMS
- Microwave modules
- Power electronics
- Quantum computing
- RF GaN 5G power amplifiers
- RF packages
- VCSEL, PD, DFB Laser, Lens Attach