Print heads typically use high aspect ratio die to maximize the number of pixels per die and to minimize the amount of silicon.
This technical paper explores production equipment and process features for practical automation of micron level placement accuracy. Control of adhesive is a critical process step required for ultra high placement accuracy of die. Results of fine line dispensing are presented as input prior to die bonding. Material feeding, identification tracking, and vibration isolation relating to ultra fine placement accuracy are also discussed.
