XY Alignment
Wafer Mapping
N-side measurement, X Accuracy Data
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Guide to Micron-Level Placement Accuracy WSP of P-Side Down Lasers in Optoelectronic Components
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What's Inside...
Terms/material and process considerations
P-side down laser attachment
Die bonder equipment overview
Capability p-side vs. N-side measures XY (graphs and diagrams included to show data)
Wafer scale consideration and results
Solder aging
Area placement accuracy
Post processing (assembly, test, saw)
Heated Wafer Stage on the 6500 WSP Die Bonder
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N-side measurement, X Accuracy Data
