Ribbon Bonding is a robust process that is more delicate to bonding pads. It can carry high current, minimize impedance and inductance, offer higher pull strenghts, last longer, and make shorter and stronger loops.

MCMs

Bonding pad shape and sturdiness are part of the equation to determine the fit for ribbon bonding on typical MCMs and hybrids.

• Flip Chip as a viable alternative
• Achieving high yield with process capability
• Challenges with high frequency devices
• Performance improvements using Ribbon Wire vs. Round Wire
• Benefits of Ribbon Wire with MCMs and Complex Microwave Hybrids
• How the wedge bonder works with Ribbon wire
• Versatility of Ribbon Bonding