Ribbon Bonding is a robust process that is more delicate to bonding pads. It can carry high current, minimize impedance and inductance, offer higher pull strenghts, last longer, and make shorter and stronger loops.
Bonding pad shape and sturdiness are part of the equation to determine the fit for ribbon bonding on typical MCMs and hybrids.
Download the paper! Benefits of Automated Ribbon Bonding for Microwave Applications
Flip Chip as a viable alternative
Achieving high yield with process capability
Challenges with high frequency devices
Performance improvements using Ribbon Wire vs. Round Wire
Benefits of Ribbon Wire with MCMs and Complex Microwave Hybrids