This paper presents a methodology and process flow supporting High Bright Light Emitting Diode (HB LED) automated assembly, supported by equipment certification, product inspection and SPC data collection methods. The methods presented in this paper have been formulated through extensive work in the high-reliability microelectronics industry and commercial production lines over the last three decades. To ensure time-to-market success in high-volume production, specific methods to achieve throughput and quality are required. This paper will cover the strategies and methods necessary to achieve the ultimate goal of an automated precision HB LED assembly—to blend the requirements of high-reliability and high-throughput to support high-volume commercial production.