Automated Epoxy Die Attach eBook

What's inside...

• High-Precision Component Epoxy Attach
• Daubing
• Stamp Transfer Method
• Epoxy Dispensing Options
• Conductive vs. Nonconductive Epoxy Process
• Epoxy Solutions
• Application Examples

epoxy dispensing, 3800 die bonder
With rapid time-to-market needs, automating the packaging process becomes necessary. Automated epoxy dispense systems have kept up with these advances by maintaining a high level of control, handling and sophisticated process control software. The epoxy must be controlled to provide good substrate, component, and die coverage.

Download now!
Automated Epoxy
Die Attach eBook

Where are you located? *

What are you looking for? *

High-Precision Epoxy Attach

dispensing options, epoxy, 3800 die bonder, die attach

The high-reliability market requires high-precision. In order to achieve this with epoxy, the bonding platform must be rigorously consistent and stable, tolerant to fluctuations in temperature and humidity. Only a sophisticated die attach machine can achieve high-precision epoxy attach.