Highlighted Specs:

• Cycle Time: 0.125 sec/wire, 0.077 sec/bump
• Placement Accuracy: +/- 2.5 micron, 3 sigma
• Large Work Area: 12"x6" with option for dual side by side stages

• Tailess Bump Mode
• Stand-Off-Stitch (Auxiliary Wire)
• TAB Bonding
• One-Step Planar Gold Bumps.

The Palomar Technologies 8000 Wire Bonder/Ball (Stud) Bumper is a fully automated wire bonding packaging system designed for high relaibility, high precision wire bonding and ball bumping. The 8000 Wire Bonder's large work area, ability to customize stages and tooling, along with a 0.75 inch capillary make it an ideal solution for complex, deep and unique packaging challenges.