Carlsbad, CA – February, 27th, 2025 – Palomar Technologies Inc., a global leader in precision microelectronics packaging solutions, is proud to announce the expansion of its Assembly Services group into the Advanced Solutions Division (ASD). This transformation represents a significant investment in advanced process development, enhanced service capabilities, and an increased commitment to customer success.
A Bold Step Forward
The newly formed Advanced Solutions Division (ASD) is an evolution of Palomar’s renowned Assembly Services team, designed to offer expanded capabilities, cutting-edge solutions, and seamless support for companies seeking expertise in microelectronics and photonics assembly. With this transition, ASD is set to provide customers with a comprehensive suite of services that accelerate time to production, improve process efficiency, and drive innovation.
"Our customers require more than just equipment—they need a trusted partner to help them bring their products to market faster and more efficiently," said Nicholas Evans, Director of Advanced Solutions. "With the expansion of our services into ASD, we are equipping companies with the tools, expertise, and infrastructure they need to succeed in today’s fast-paced, high-precision manufacturing landscape."
What ASD Offers
As a fully integrated division of Palomar Technologies, ASD offers an expanded portfolio of services that cater to start-ups, established enterprises, and research institutions alike. These services include:
A Strategic Investment in Innovation and Customer Success
The formation of ASD is part of a larger strategic initiative by Palomar Technologies to provide end-to-end solutions that bridge the gap between process development and full-scale manufacturing. The investment in new capabilities, engineering expertise, and state-of-the-art facilities ensures that ASD remains at the forefront of microelectronics packaging innovation.
"This is a milestone for Palomar Technologies and our customers," said Rich Hueners, Chief Commercial Officer. "With the expansion into ASD, we are reinforcing our commitment to helping our customers scale their production faster, reduce time to market, and achieve higher levels of operational excellence."
Positioned for Growth and Industry Leadership
With decades of experience in high-precision assembly, Palomar Technologies is poised to lead the next wave of advancements in semiconductor packaging, photonics integration, and advanced manufacturing. The creation of ASD ensures that customers benefit from both cutting-edge technology and world-class expertise to achieve sustainable, scalable growth.
For more information about Palomar Technologies and the Advanced Solutions Division, please contact us.
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with its Advanced Solutions Division for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved product quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and, China. For more information, visit: http://www.palomartechnologies.com.
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Media Contact:
Erin Schaefer
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Email: eschaefer@bonders.com
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