Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of their unique property of having a eutectic melting point. Eutectic melting points are much lower than the melting points of the metals that make up the alloy. The challenges to eutectic attach are derived from the short amount of time the solder remains liquid and the general method to introduce the solder in the bonding process.
While the challenges have always been present and can be worked around without too much difficulty in non-automated environments,
Read our full article in Chip Scale Review: https://www.chipscalereview.com/blog/Eutectic-die-attach:-a-highly-reliable-solution-for-advanced-materials-and-automation-challenges?
Download these resources for more information on eutectic die bonding:
3880 Die Bonder Brochure | 6500 Die Bonder Brochure |
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Kyle Schaefer
Product Marketing Manager
Palomar Technologies, Inc.
Anders Schmidt
Applications Engineer II
Palomar Technologies, Inc.