Hybrid components and high-power communication devices are classified as high-performance and high-capacity die attach applications. These types of
The essence of a eutectic reaction is going from liquid to solid, bypassing the plastic state, using eutectic heating and cooling. Eutectic alloys for soldering are composed of Sn (tin), Pb (lead), Ag (silver) and Au (gold). When different metals are combined into alloys, a range of melting temperatures are created with varying proportions of each metal used: AuSi@363°C, AuSn@280°C.
During eutectic die attach, the substrate is heating to a temperature just below the solder's eutectic temperature. During the bond cycle, an incremental thermal energy is supplied to the solder layer to promote the solder melting process. Liquified solder then penetrates both bonding surfaces. The result is an intermetallic bond (also known as wetting) develops.
Pulsed Heat System
A high-accuracy pulsed heat system was specially designed in order to allow for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. This system enables precision eutectic die attach through a customizable computer-controlled heating and cooling profile. The software provides a highly regulated temperature profile and data feedback throughout the process.
Two important methods to meet accuracy and throughput requirements:
For more resources on eutectic die bonding or the Pulsed Heat System, download these resources:
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Janine Hueners
Marketing Specialist
Palomar Technologies, Inc.