When searching for a small footprint die bonder, choosing a system backed by decades of R&D, prototyping and production expertise combined with reliable support and customer services will only increase the longevity of your investment.
Small Footprint Die Bonder For Ultra-High Accuracy
The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary 1.5µm micron-level placement accuracy (application-dependent) for photonic, wireless and medical applications. Currently deployed 6500 Die Bonder systems are exceeding their “work horse” expectations with production bouts exceeding 20 hrs/day, six days a week for die attach in optoelectronic and printhead assemblies.
Wafer Scale Packaging (WSP)
A specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die attach provides customers with a complete microelectronic solution for laser diode attachment (die-to-wafer), pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.
6500 Die Bonder WSP Features
An advanced Cognex pattern recognition system enables the 6500 Die Bonder lookdown camera to locate the wafer substrate locations and laser using multiple search and alignment algorithms, including area and edge alignment. The lookup camera identifies any needed corrections in the pick process. This system includes auto focusing with programmable on- and off-axis lighting systems to maximize contrast and accuracy in component placement.
Operating in a true Microsoft Windows XP Pro environment, the wafer scale packaging eutectic capabilities on the 6500 Die Bonder bring unparalleled software flexibility, power and ease-of-use to precision hybrid component assembly. The user-friendly interface assists in setup, operation, diagnostics and calibration.
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Jim O'Bryan
Chief Engineer
Palomar Technologies