As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing product from tape after wafer processing and dicing is complete. While traditionally product was removed by hand through the use of a needle and vacuum wand or tweezers, today’s smaller, fragile and complex devices require a more precise process.
Die Sorting At a Glance
A die sorting system is designed to remove die from tape using an ejector mechanism and place them to output carriers, such as Gel-Pak, waffle pack, JEDEC tray, film frame or grip ring. Whether semi-automatic or fully-automatic, a die sorter offers a number of advantages over a manual die handling process. Semi- and fully-automatic die sorters provide the user complete control over the exact die eject parameters, such as eject needle height, eject speed and placement pattern on the output through the use of process recipes. This allows repeatable processing from one die to the next of the same product, as well as different settings to be used for different products. With every die picked in the same manner, process yield and throughput are increased while damage to devices from manual handling is eliminated. In addition, ergonomics for the operator is greatly enhanced.
Semi-Automatic? Fully Automatic? Which to Choose
When evaluating a die sorter solution, it is important to consider
For processes that require a higher throughput or greater die traceability, a fully-automatic solution is recommended.
Flip Chip and MEMS Application Process Solution
Both the Royce DE35-ST and MP300 die sorters offer quick-change tooling to support high-mix, medium-volume applications and are configurable to meet a wide variety of process requirements. For flip chip applications as an example, Royce offers a die inverter to flip the die prior to placing it to the output tray. In addition,
Royce Instruments invites you to visit booth #308 at the 2012 IMAPS exhibition in San Diego to discuss your die sorting process and see a live demonstration of the Semi-Automatic DE35-ST Die Sorter. For those interested in bond testing, Royce’s latest bond tester, the Royce 620 Multitest Bond Tester from the Royce 600 Series Bond Test Instruments, will also be on display.
Can’t Make It to the Show?
For more information on the Royce Instruments, Inc. product line of US-designed and manufactured bond testers and die sorters, contact Sarah Kinzli, Sales Applications Engineer, at skinzli@royceinstruments.com or (707)255-9078 x142; visit Royce online at www.royceinstruments.com; or contact Palomar Technologies.
Download these resources to learn more about Royce:
Royce Instruments Data Sheets |
Introduction to Automated & Semi-Automated Die Sorting eBook |
Introduction to Automated Flip Chip Assembly eBook |
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Palomar Technologies would like to thank Sarah Kinzli and the Royce Instruments team for their valuable overview of die sorting solutions. The Royce MP-300 and DE35-ST die sorters will enhance your automated die attach processes on a 3800 Die Bonder, 6500 Die Bonder or a factory-refurbished 3500-III-R Die Bonder.