The High Power Semiconductor Market enjoyed a steady growth rate over more than 15 years and is still forecasted to continue the same healthy upwards trend within the upcoming years. Continual adjustments to the performance of increasing power requirements for the modules are leading engineers to rethink how to improve the processability of the interconnects.
To address this specific market need, SST Vacuum Reflow Systems, a Palomar Solution, engineered a sophisticated, fully automated, and dedicated machine platform. The SST 8300 Series Automated Vacuum Pressure System provides superior bond technology for soldering or sintering processes. A modular concept, together with intelligent industry-standard MHS solutions, allows for flexible upscalability to match production throughput for each customer device.
One of the 8300 platform advantages is to execute all process steps within a single chamber, which provides a highly reliable connection with an outstanding low void rate, better than today’s market requirements. This is key to delivering high-reliability power electronics applications
The SST 8300 Series differs from the majority of systems on the market by utilizing SST’s unique method of applying both vacuum and gas pressure for the interface of critical components inside power electronics, dies to DBC, connectors/pins to DBC and DBC to base plate soldering.
Typical Applications:
