This is the second blog of the Frequently Asked Questions mini-series. This mini-series discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 Wedge Bonder. Check back each week to see the most frequently asked questions for your favorite machines. This week we are discussing the 8000i Wire Bonder. We have split the frequently asked questions for the 8000i into two blogs, since there are so many questions. Check back next week for part two.
What is the total bonding area that you can vision and bond to?
12” (305mm) in the X axis, 6” (152mm) in the Y axis
What is the range of capillary lengths the 8000i can bond with?
The Model 8000i can bond with a wide range of capillaries. We recommend using the shortest cap that works with your application. The most common length is 0.437”. If that is too short, then next typical length is 0.625”. You can bond with high reliability all the way up to a 0.750” cap. There are other sizes that work in between these typical lengths as well:
What can we do if we cannot heat the package up to 150C?
Can the system perform both ball bumping and traditional wire bonding with traditional wire and capillaries?
Yes, it can. The 8000i Wire Bonders’ compound Z-Axis allows the system to bond traditional ball/stitch wires, ball bumps or stacked ball bumps of many shapes and sizes, or a combination of the two that we call “Stand-Off Stitch” bonding.The SoS mode provides the highest degree of reliability available for ball bonders on the market today.
What types/sizes of heated stages do you offer?
Can the system be configured with a tool heater?
Yes, the 8000i Wire Bonder can be configured to use the option tool heater, either at the factory prior to acceptance testing or later in the field at the customer’s site.
Can the system be configured with a material handling system?
Yes, the system can have a variety of material handlers: Inline handlers, push-pull handlers, auto-continuous handlers, etc. each with its own custom tooling. These options can be manually fed materials, or for the inline handlers, low and high capacity up and downstream magazine handlers that can connect via a true SMEMA interface.
What ultrasonic frequency does the bonder run at, and can the system be configured for High Frequency Ultrasonics?
The standard system operates at 60 KHz. This is highly recommended, as higher frequencies come at a process capability price. The unit can also be converted, at the factory or in the field to 120 KHz ultrasonics. These high frequency options allow for better bonding at lower temperatures and can provide a finer pitch result.
Download these resources for more information:
8000i Data Sheet | i2Gi® eBook | Field Services Data Sheet |
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If you have more questions about the 8000i Wire Bonder, please contact Katie Finney at kfinney@bonders.com. Don’t miss the second part of the frequently asked questions for the 8000i next week.
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Bradley Benton
Regional Account Manager, Western Americas
Palomar Technologies, Inc.