Have your engineers ever encountered challenges with locating parts while working with a die or wire bond application? This can be a tedious and time consuming process. Increasing efficiency and reducing costs are major goals for any organization.
VisionPilot® utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and cost. For locating parts or features, VisionPilot provides the maximum referencing yield and reliability available in a vision system. VisionPilot is not only available for die bonding, but now is also available for wire bonding.
Die Attach Assembly Sequence
Wire Bond Assembly Sequence (Using the package which was already die bonded)
Alternate Reference and Reference Parts
Both die and wire bond face similar challenges when referencing the package. Die attach faces an extra challenge in needing to reference components which are presented in random orientations. Wire bond faces extra challenges in needing to reference components such as feed-through pins or components that have epoxy or solder around them.
Substrate Reference | Thick-Film Fiducial |
Horizontal Feed |
Alternate Reference will automatically try another reference for a part if necessary. Alternate parts allow a program to contain die from alternate suppliers to be in the same program, including the separate wiring if necessary. The program will automatically detect the part using vision and then wire it. Alternate parts can have alternate references within the part.
The Benefits of VisionPilot for Wire Bond include:
For more information on VisionPilot, download the data sheet:
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Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.