As telecommunications and information processing have exploded over the several decades, the need for extremely accurate, high-yield microchip assembly solutions has shifted from a low volume aerospace and defense industry niche to a broad, high-volume commercial market encompassing multiple industries. From palmtops to telecommunication switches, the RF-IC industry is witnessing an insatiable requirement for more and more accurate devices at ever increasing and more cost-effective production rates.
The keys to responding to this challenge are improved hardware and software to enable greater speeds without sacrificing precision, increased automation to eliminate error-prone human handling during processing, and greater integration to create a seamless, integrated assembly platform—complete process solutions coupled with agile automation.
The die attach machine utilizes a general purpose optical workbench platform with command and I/O-rich programming to accommodate virtually any combination of material presentation devices for assembly automation. These component presentations include waffle pack, gel pack, tape and reel and expanded wafer configurations. Two- and four-inch waffle and gel packs may be utilized. Wafers from three to eight inch can be accommodated, with multiple wafer presentation available (1-up, 2-up, 4-up and 6-up).
Utilizing HotRail RFA technology, operators can load an entire shirt of parts at once while the component assembly system can eject and attach fragile die of materials such as Gallium Arsenide (GaAs). The HotRail high-accuracy attach process provides void-free assembly and programmable steady state phased heat control for high-yield eutectic die attach.
An advanced temperature-profiling device and method eliminates eutectic control inconsistencies common in today's die-attach methods, and provides programmability for increased yield and throughput. RF headers are conveyed through a ramped temperature gradient that gradually brings the packages to the eutectic reflow temperature. After chip placement, the packages are conveyed out of the placement area and gradually returned to ambient temperature. The system supports tightly regulated temperatures of the preheat, eutectic and cool-down zones.
Transfer and scrub parameters are programmed and the temperature is set to achi
The HotRail RFA eutectic die attach system provides high-precision, high-reliability placement of components to meet today's high-volume, low-cost RF assembly requirements.
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Jessica Sylvester
Marketing Communications
Palomar Technologies, Inc.