9000 Fine Wire Wedge Bonder

Last week, Palomar Technologies announced the launch of its 7^th wedge bonder: the 9000 Fine Wire Wedge Bonder. Palomar/Hughes started designing and manufacturing wedge bonders in the early 1980s for the aerospace and defense industries. Later, these machines were used for a wider array of applications beyond just military, including medical devices, RF/Wireless packages, automotive sensor systems, and optoelectronic systems and components. This further developed Palomar’s expertise in fine wire Al and Au wedge bonding. 

A unique aspect of the 9000 is that it is state-of-the-art and built upon proven aspects of other Palomar platforms. It is far easier to learn a new machine when the logic and functionality is fundamentally the same across a variety of platforms. For example, the ergonomic user interface and clam shell design was adapted from the 3800 Die Bonder and the i2Gi interactive GUI software came from the 8000i Wire Bonder/Ball (Stud) Bumper. The 9000 wedge bonder has a cantilever design which is the same as the Palomar 8000i wire bonder, 3800 die bonder, and 6500 die bonder - a design which has been proven over decades.

3800 Die Bonder with automated material handling

Unique Features