Carlsbad, CA – July 3, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157.
Palomar Technologies Assembly ServicesTM ("Assembly Services") is the contract assembly, process development, test and prototyping division of Palomar Technologies, ensuring strict IP protection, in-house highly skilled engineering staff and technicians, and a product suite of high-reliability, ultra high-accuracy advanced packaging systems. Assembly Services’ example capabilities—including flip chip, wafer level packaging, pick-and-place, deep access wire bonding and complex packaging processes—will be headlined throughout the Palomar Technologies exhibit space.
Palomar Technologies is accepting meeting requests throughout the duration of SEMICON West 2012. Requests may be submitted online at www.palomartechnologies.com/contact-us.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
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