Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.
How Wedge Bonding Works
A wire is passed through the wedge tool over the microchip. The wedge tool then settles over the area that needs to be wired up. The tool descends to the surface so that the wire is pressed between the substrate and the tip of the wedge tool (the surface is usually gold or aluminum, but could also be palladium or silver). Ultrasonic energy is applied and the result is a wedge bond. A loop is then formed and a second wedge bond if produced. Then the loop is terminated by breaking the wire and forming a tail under the wedge tool for the next first bond of the next loop.
Choosing a wedge bonder that is efficient and intuitive is significant to achieving success with an application. The 9000 Wedge Bonder has some distinguishable features which set it apart in the wedge bonding world:
Wire Feed Angle – 45/60 Degree
Wire Feed Angle – 90 Degree
Wedge Tool Change
Other Key Differentiators
For more information on wedge bonding or the 9000 Wedge Bonder, download the resources below:
9000 Wedge Bonder Data Sheet |
Modern Wedge Bonding eBook |
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Janine Hueners
Marketing Specialist
Palomar Technologies, Inc.