---
title: Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
description: Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps and specialty interconnects.
---

[PTI Blog ](https://www.palomartechnologies.com/blog)

# [Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects](https://www.palomartechnologies.com/blog/bid/62846/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects)

 Written by [Palomar Technologies MarCom Team](https://www.palomartechnologies.com/blog/author/palomar-technologies-marcom-team) | Fri, Jul 15, 2011 @ 14:07 PM

Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps and specialty interconnects. Multipurpose wire bonders accommodate large work area, deep access, and a complex mix of bond surfaces, wire shapes, and bumps—many odd-form packages rely on the capabilities of a [multipurpose wire bonder](https://www.palomartechnologies.com/8000-wire-bonder/ball-stud-bumper/) because these complex bonds simply cannot be bonded on semiconductor bonders.

Palomar Technologies [Sr. Scientist, Daniel Evans](https://www.palomartechnologies.com/about-us/management-team/senior-scientist/), and Sr. Applications Engineer, David Rasmussen, recently presented their latest technical paper “[Multipurpose Wire Bonding – Wires, Bumps and Combination Interconnects](https://www.palomartechnologies.com/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects/)” at the IMAPS Wire Bond Topical Workshop held on July 14th in concurrence with SEMICON West 2011. Complex, deep access and odd-form wire bonding were very topical on the SEMICON show floor and in the Palomar Technologies booth this year as attendees are searching for [hi-rel and fully automated wire bonding systems](https://www.palomartechnologies.com/blog/bid/62846/8000-wire-bonder/ball-stud-bumper/).

This *highly* technical paper covers four cases highlighting the range of applications that can be bonded on a multipurpose bonder:

**Case 1:** Ball bump examples

**Case 2:** Deep access of 0.535” using a 0.750” capillary

**Case 3:** Ambient wire bonding to a 6” tall package

**Case 4:** Batch load tray (mechanical and vacuum clamping)

[Download the technical paper](https://www.palomartechnologies.com/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects/) to learn more about hi-rel, fully automated wire bonding systems.

*----*  
*Jessica Sylvester*  
*Marketing Communications*  
*Palomar Technologies*

[View full post](https://www.palomartechnologies.com/blog/bid/62846/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects)

```json
{
  "@context" : "http://schema.org",
  "@type" : "BlogPosting",
  "author" : {
    "@type" : "Person",
    "name" : "Palomar Technologies MarCom Team"
  },
  "dateModified" : "2017-07-14T04:44:40.972Z",
  "datePublished" : "2011-07-15T14:40:00Z",
  "headline" : "Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects",
  "image" : {
    "@type" : "ImageObject",
    "height" : 264,
    "url" : "http://cdn2.hubspot.net/hub/60069/file-26138176-jpg/images/chain-bonds_stand-off-stitch.jpg",
    "width" : 723
  },
  "mainEntityOfPage" : "https://www.palomartechnologies.com/blog/bid/62846/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects",
  "publisher" : {
    "@type" : "Organization",
    "logo" : {
      "@type" : "ImageObject",
      "height" : 60,
      "url" : "/hs/hsstatic/content_shared_assets/static-1.4092/img/default-amp-logo.png",
      "width" : 60
    },
    "name" : "PTI Blog"
  }
}
```