Whether it is for a critical biomedical device, the latest spacecraft or military weapon system or just your new big screen TV at home, the security and reliability of the wire bonding interconnect is of up-most importance.
In pursuit to improve wire bond reliability, our engineers have adjusted wire dopants to enhance crystal structure in the Heat Affected Zone, allowing for various loop modes on the wire. These adjusted wire dopants also reduce the likelihood of the formation of intermetallic contaminants. This improved wire bond reliability solution has:
The integrity of a wire bond interconnect is significantly improved through the proper use of Auxiliary Wires—Security Wires, Security Bumps, or Stand-Off Stitch (a.k.a. Stitch on Bump). Stand-Off Stitch (SOS) has many more applications and side benefits that could be incorporated into a circuit design for better wire strength properties, fewer interconnects (die-to-die bonding or chain bonding) and lower loops.
Goodrich, a renowned global supplier of systems and services to the aerospace and defense industries, has achieved a considerable increase in their wire bonding quality with Palomar Technologies’ Stand-Off-Stich bonding process: