Today’s mainstream electronics manufacturing consists mainly of semiconductor packages and surface mount technology processes. Together, the two make up the vast majority of readily acknowledged devices from cell phones to PCs, tablets, and laptops. Even smart high-end toasters leverage these two technologies. The resulting products also end up in automobiles, stereos, TVs, and remote controls. A lesser known technology, however, is working its way into both of these markets – microelectronics.
Below are some abbreviated definitions, meant to gain some common understanding before diving in further:
While SMT technology generally incorporates semiconductor products, semiconductor products do not typically include SMT components.
Microelectronics can incorporate both, and the result is smaller and usually faster final products. Through-hole technologies are becoming rare.
Microelectronics is a growing packaging method and is working its way into both of these mainstream markets – but in a different way. Both semiconductor and microelectronic packages can utilize the same (or similar) manufacturing techniques. Both can mount bare die with conductive or non-conductive epoxies, or eutectic solders. Both generally employ traditional wire ball bonding for the first level interconnects. These markets are distinct, but they do mix.
Just as SMT technologies incorporate semiconductor packages but rarely the other way around, microelectronics can incorporate both semiconductor and SMT technologies to create complex packages and products.
For example, an automated component placement system like Palomar Technologies' 3880
There is an interesting mix of relationships between these markets, with microelectronic packaging technologies fully capable of addressing all three markets – something the other two markets cannot suggest.
More resources:
3880 Die Bonder |
VisionPilot Data Sheet |
8000i Wire Bonder |
i2Gi Data Sheet |
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Bradley K. Benton
Western Regional Sales Manager
Palomar Technologies, Inc.