Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras continue to merge into a common device that will benefit from
Shrinking electronic package geometries are driving continuous improvements in interconnect technologies. Wire bonding is a mature technology that continues to meet challenges of finer geometric capability: loop shape, bond pitch, ball size, and stitch size control.
The packaging industry is looking for a common set of improvements as geometries continue to shrink:
Adaptive Bond DeformationTM
Adaptive Bond DeformationTM is a method recently developed to control the geometry of both ball and stitch according to process parameter inputs supplied by the user.
Ball Geometry and Shear Definitions
Measure |
Definition |
FABD |
Free air ball is the diameter of the ball created from the electronic flame off process while the ball is in free air and before it contacts the bond surface. |
MBD |
Mashed ball diameter is the diameter of the ball after ultrasonic bonding is complete. (Largest diameter in plan view) |
BBD |
Bonded ball diameter is the diameter of bond contact between ball and substrate. |
TH |
Top height is the height of ball measured from substrate surface to top of the ball. |
SF |
Shear force of the ball in grams |
SS |
Shear strength of the ball is calculated as the SF/BBD area in grams/mil2. |
Learn more. Download "Geometry & Bond Improvements for Wire Ball Bonding & Ball Bumping."
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Daniel Evans
Senior Scientist / Applications Manager
Palomar Technologies