About

About
Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Overview

Company Overview Corporate Information Events

Press Releases Employment Opportunities
Products
Products

Overview>

Palomar Die Bonders>

Palomar Wire & Wedge Bonders>

SST Vacuum Reflow Systems>

SST High Vacuum Furnaces>

Die Bond Features>

Wire Bond Features>

Vacuum Reflow Features>
Palomar Die Bonders
3880-II Die Bonder 6532HP Die Bonder 6500 Die Bonder

Palomar Wire & Wedge Bonders
9000 Wedge Bonder 8100 Wire/Ball Bonder

SST Vacuum Reflow Systems
8300 Series Automated Vacuum Pressure Soldering System 5100 Vacuum Pressure Furnace 3130 Vacuum Pressure Furnace 1200 Table Top Furnace 518 Vacuum Pressure Furnace

SST High Vacuum Furnaces
3150 High Vacuum Furnace 3250 High Vacuum Wafer Furnace

Die Bond Features
Bond Data Miner Pulsed Heat Systems VisionPilot® Wafer Die Ejection Systems

Wire Bond Features
Bond Data Miner Intelligent Interactive Graphical Interface® (i2Gi®) VisionPilot®

Vacuum Reflow Features
Graphite Tooling
Applications

Applications
Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.

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Overview

Automotive Lasers LEDs Medical & Bio Photonics Military, High Reliability & MEMS

Photonics Power Semiconductors RF, Microwave & Wireless Sensors Telecom, 5G & Datacom
Processes
Processes

Overview>

Die Bonding>

Wire Bonding>

Vacuum Reflow>
Die Bonding
Epoxy Die Bonding UV Die Bonding Solder Paste Die Attach Eutectic Die Bonding Silver Sintering Die Bonding Thermocompression Die Bonding

Wire Bonding
Gold Wire Bonding Aluminum Wire Bonding Ball Bumping Wedge Bonding

Vacuum Reflow
Glass to Metal Sealing High Vacuum MEMs Packaging Hermetic Package Sealing Fluxless Eutectic Solder Attach Solder Paste Reflow Attach Pressureless Sintering Die Attach
Services

Services
Palomar Technologies has a worldwide team of engineering experts trained to maximize system uptime and to support production needs of customers around the globe.

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Overview

Service Contracts Service Calls Training

System Upgrades Process Development Prototyping/Contract Manufacturing (OSAT)
Innovation Centers

Innovation Centers
Palomar® Technologies Innovation Centers are full-service OSAT laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, and outsourced package assembly, test, and measurement.

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Overview

Innovation Center - USA Innovation Center - Asia

Demonstration Lab – EPIC, Paignton, UK Research Initiative – Fraunhofer IISB
Resources

Resources
Get access to our entire knowledge database: read blog articles and download materials.

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Overview

Blog Brochures

Technical Papers & eBooks Videos & Webinars
Contact Us

Contact Us
Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Overview

Contact Us

Service

UPCOMING EVENTS

iMAPS International Symposium on Microelectronics

October 4 - 5, 2022

Visit Palomar Technologies at the iMAPS International Symposium on Microelectronics in Boston, Massachusetts in booth 110. Learn about our newest product solutions for your packaging needs.

Palomar-Booth

UPCOMING EVENTS

iMAPS International Symposium on Microelectronics

Request a Meeting With Us During an Event