---
title: Wire Bonding - Gold Ball Bumping
description: Gold Ball Bumping is an evolution of the 50 year old wire bonding process.
---

[PTI Blog ](https://www.palomartechnologies.com/blog)

# [Wire Bonding - Gold Ball Bumping](https://www.palomartechnologies.com/blog/bid/13285/Wire-Bonding-Gold-Ball-Bumping)

 Written by [Palomar Technologies MarCom Team](https://www.palomartechnologies.com/blog/author/palomar-technologies-marcom-team) | Fri, Apr 03, 2009 @ 18:04 PM

Gold-ball bumping - or stud bumping - can be accomplished with commercially available gold wire bonders using a 1-mil gold wire. In fact, gold ball bumping is an evolution of the 50-year-old wire bonding process.

In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated circuit (IC) and substrate. With the ball connected, the wire is fed out and attached to a second surface, and then torn off to complete the connection.

In the ball-bumping process, instead of making the second connection with a wire loop and stitch, the wire is removed after the ball is connected to the die. A new ball is formed and the process repeats as necessary on all the die bond pads.Gold-ball bumping can be a one-step process, but can involve two steps if a coining process is needed to planarize the ball bumps.

Once the die is completely bumped, it is flipped and attached to the substrate, providing the first-level interconnect as well as protection for the active die surface.

[View full post](https://www.palomartechnologies.com/blog/bid/13285/Wire-Bonding-Gold-Ball-Bumping)

```json
{
  "@context" : "http://schema.org",
  "@type" : "BlogPosting",
  "author" : {
    "@type" : "Person",
    "name" : "Palomar Technologies MarCom Team"
  },
  "dateModified" : "2017-07-14T04:44:40.970Z",
  "datePublished" : "2009-04-03T18:20:00Z",
  "headline" : "Wire Bonding - Gold Ball Bumping",
  "image" : {
    "@type" : "ImageObject",
    "url" : "http://solutions.palomartechnologies.com/Portals/60069/images/bumps%20in%20a%20line.jpg"
  },
  "mainEntityOfPage" : "https://www.palomartechnologies.com/blog/bid/13285/Wire-Bonding-Gold-Ball-Bumping",
  "publisher" : {
    "@type" : "Organization",
    "logo" : {
      "@type" : "ImageObject",
      "height" : 60,
      "url" : "/hs/hsstatic/content_shared_assets/static-1.4092/img/default-amp-logo.png",
      "width" : 60
    },
    "name" : "PTI Blog"
  }
}
```