ABOUT US
These distinct technologies make Palomar® Technologies a global leader in high accuracy die attach, wire bond, and vacuum reflow technologies.
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Adaptive Bond Deformation™ (ABD) for ultimate control over ball and stitch deformation
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Bond Data Miner™
(BDM) is a software feature that provides part traceability, predictive process capability, and monitors machine fitness -
VisionPilot® with Radar Referencing® and VisionPilot® with Vision StandardizationTM
(available on die bonders and wire bonders) -
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Apparatus for Rapid Cooling of Substrates Utilizing a Flat Plate and Cooling Channels(SST International U.S. Provisional Patent Application Serial No. 62/351,817)
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Low Voiding Solder Paste Profile for Microelectronic Packaging(SST International U.S. Provisional Patent Application Serial No. 62/357, 495)
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Enhanced Loop Mode™(ELM) provides exceptional long, low loop capability, with loops up to 10mm.
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Dual-Axis Bond Head,
Digital Dispensing™ for very precise dispensing for low volume application Dual-Axis Bond Head
Palomar Technologies patent US 6,102,275 -
High Vacuum MEMs packaging with thermal Getter firing, and low chamber virtual leak design.
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Low void solder technology utilizing Vacuum and Pressure with precise pressure and temperature control.
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Free floating weights for optimized solder reflow.
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Two zone heater control for large batch furnace temperature uniformity.
- Semiconductor grade graphite for:
- Heater for high power density, rapid temperature rise, long life and low cost of ownership.
Carrier boat and fixtures to accommodate rapid temperature rise without material warpage, durability and long life.
- Graphite particle elimination.
- Spring design and manufacturing to hold parts or carrier boats.
- Design and fabrication of complex and layered packaging of micro-electronics assemblies.
- Heater for high power density, rapid temperature rise, long life and low cost of ownership.
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Cold wall process chamber design with high temperature application of 1000 Centigrade. For precise temperature control at extremely high temperatures. The chamber can be both high and low vacuum design.
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