SST 8301 Automated Vacuum Pressure Soldering System

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The SST 8301 Automated Vacuum Pressure Soldering System is setting new industry standards for flux-less soldering by providing
highly reliable and reproducible solder interfaces with industry leading void rates.

The SST 8300 Series is an automated vacuum pressure soldering system setting new industry standards for flux-less soldering by providing highly reliable and reproducible solder interfaces using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.

SST_8301_left-side_1

 

Applications
  • IGBT Modules
  • Power Module Assembly
  • GaAs/GaN/SiC Die Attach
  • Die Attach for Pressure Sensors
  • High Intensity LED Attach
  • Multilayer Ceramic Capacitors
  • CPV Solar Cell Assembly
  • High Power Laser Module Assembly
  • Copper Clip Soldering
  • Hermetic Sealing of IR Image Sensors
  • Hermetic Sealing of Hi-Rel Packages

 

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