Palomar Technologies senior scientist, Daniel D. Evans Jr., delves into the world of wire bonding and chain bonding method, of an RF-SOE Packgage. Mr. Evans also discusses the practical application comparison, including cost and yield, of a ball bonder vs. a wedge bonder.
Download to learn more about:
- Chain Bond Development Progression
- RF-SOE Chain Bonding Results
- Chain Bond on Bumps
