In March 2015, Palomar Technologies acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, glass-sealing and wafer bonding of microelectronic packages and components. SST International, now known as SST Vacuum Reflow Systems, compliments Palomar’s existing line of wire and die bonders to provide customers the premier “one-stop shop” for precision assembly and hermetic packaging of electronic components.
- Void-Free Die Soldering
- Glass to Metal Sealing
- Hermetic Package Sealing
- High Vacuum MEMS Package Sealing
- Wafer Level Packaging and Wafer Bonding
**Partial list. View the full list here.
SST Vacuum Reflow Systems' mission is to develop, deliver and support innovative assembly equipment and services to meet our worldwide customers' requirements for thermal processing solutions for their high reliability microelectronic products. Our business is driven by our core values of integrity, innovation, technological leadership, outstanding quality, customer service and partnership.
SST Vacuum Reflow Systems is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment.