Over the years, mircoelectronic wire bond process and packaging engineers have debated whether to use Ball or Wedge bond technologies.
There is little debate that ball bonding is faster and more robust; however due to a need for low-profile interconnects or fine pitch, wedge has continued to dominate key market segments, specifically in the areas of RF Designs and fine pitch packaging.
- Compact hybrids
- Fine pitch devices
- High frequency passive and active components
- Advanced LED designs
- MCM power connections
- Microstrip transmission lines
- Microwave devices/tuning
- RF packaging
- Wave guides