SST Vacuum Reflow Systems is now part of Palomar Technologies.
On this newly combined website, you can find all the relevant information from Palomar and SST on our wide range of packaging solutions and services. All our systems are proudly designed and built in the US, and operated by electronics manufacturers worldwide.
In March 2015, Palomar Technologies acquired SST International, a global supplier of vacuum and pressure furnaces for void-free, flux-free die attach, brazing, glass-sealing, and wafer bonding of MEMS and other high-performance microelectronic packages and components.
SST International, now known as SST Vacuum Reflow Systems, extends Palomar's existing line of wire and die bonders, providing the broadest array of advanced packaging solutions for precision assembly and hermetic packaging of electronic components.