Glass to Metal Sealing_1.jpg

3150 High Vacuum Furnace

Overview

The SST 3150 is a high vacuum furnace that provides advanced packaging capabilities in vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). The clean-room compatible system may also be configured to allow for in situ separation of lid and package, getter firing and sealing of MEMS packages. The 3150 utilizes a turbo-molecular drag pump for effective pumping of hydrogen gas molecules. An optional cryogenic water pump may be added to the system for processes requiring extremely low levels of residual water vapor.

glass to metal sealing

High Vacuum Furnace Applications

  • MEMS Package Sealing
  • Infrared Sensor Package Sealing
  • Crystal Oscillator Package Sealing
  • Hermetic Package Sealing
  • Wafer Level Packaging
  • Void-Free Eutectic Die Attach
  • Low Moisture Package Sealing
  • Nobel Gas Miniature Lamp Sealing
  • Military Electronic Package Sealing

Common Applications

  • Accelerometers
  • Atomic Clocks
  • Automotive Sensors
  • High Accuracy Gyroscopes
  • MEMS Devices
  • Miniature Crystals
  • Miniature Lamps
  • Night Vision IR Sensors
  • Oscillators
  • Pressure Sensors
  • Solid Oxide Fuel Cells
  • Uncooled Microbolometers

Features

High vacuum capability for low residual vacuum MEMS packages. Turbomolecular pump enables vacuum to 10-7 Torr or lower. The in situ Getter Activation maintains long-term low vacuum within package. The precise heat and cool controls allow for accurate control of thermal cycles. It automated linear motion stage provides component separation and getter activation. Multiple thermal zones are ideal for complex MEMS package assembly. Resistive graphite heat system results in precise control of components.The 8000i Wire Bonder also features Continuous Bonding Technology, which can load parts onto the wire bonder while it is bonding.

Download the 3150 High Vacuum Furnace Data Sheet

Download the 3150 High Vacuum Furnace Data Sheet

Graphite, ceramic, and metal fixtures are required for most microelectronic assembly processes. Learn more about tooling.
Find Out
Other Resources
Download the 1500 Wafer Aligner Data Sheet
Download the 3130 Vacuum Pressure Furnace Data Sheet
Download the 5100 Vacuum Pressure Furnace Data Sheet
Learn more about Automated Epoxy Die Attach