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518 Vacuum/Pressure Furnace

Overview

The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

518 Vacuum/Pressure Furnace
518 control panel

The 518 benefits include:

  • Precise control of soldering process profile
  • Consistent, highly reliable solder interface
  • Accurate control of thermal cycles
  • Ease of use and flexibility of operation

Processes

Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.

  • Flux Free Solder Process Development

  • Assembly of High Reliability Microelectronic Packages

  • Hybrid Microelectronic Circuit Assembly

  • Fiber Optic Package Assembly

  • Ceramic Package Sealing

Features

  • Cooling water chiller and pump
  • Multiple point temperature recording
  • Formic acid
  • Flux trap
  • Monitoring thermocouplers
  • Moisture analyzer
  • Oxygen analyzer
  • Plotted profile charts
  • Offline programming

Applications

  • Accelerometers
  • Atomic clocks
  • Automotive diodes
  • Automotive sensors
  • CPV solar cell modules
  • Fiber optic devices
  • Flip chips
  • GaN MMICs
  • Gated light arrays
  • Glass diodes
  • Glass-to-metal seals
  • Hearing aid amplifiers
  • Hermetic feed-throughs
  • High accuracy gyroscopes
  • Implantable medical devices
  • Laser pump diodes
  • LED lamps and heaters
  • MEMS devices
  • Microwave packages

Download the Model 518 Data Sheet

Download the Model 518 Data Sheet

Graphite, ceramic, and metal fixtures are required for most microelectronic assembly processes. Learn more about tooling.
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