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3880 Die Bonder

Overview

Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable multiple die-type bonder on the market. The machine’s 5um placement accuracy capability, 250 millisecond tool change time, and excellent tool-to-tool planarity offer its users a combination of high-accuracy and peak repeatability performance across a large work area. Presentation options include combinations of wafers, waffle/gel pak, inline conveyors for carriers and boats, tape and reel, and JEDEC tray feeders.  

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As part of the 3880’s continuous improvement program, the integrated Z-theta bidirectional bond head is designed with voice coil technology to enable: 

  • Thin die handling and wider force ranges
  • Improved force linearity
  • Fast tool change speed: 250 milliseconds
  • Tool to tool index precision for die placement planarity repeatability: 0.00361 degrees, 3 sigma
  • Setup ease and lower maintenance costs 

Process optimization and speed improvements can be realized using robust fiducial and referencing technology. VisionPilot® with Radar Referencing provides this pathway to optimization by using advanced geometric pattern matching technology. The result is reliable, accurate, and fast location of parts. Even under the most challenging conditions, this exclusive software can significantly reduce or eliminate fixturing requirements and costs. For locating parts or features, VisionPilot® provides the maximum inspection yield and reliability.

Multiple Options in a Single Machine

  • 8-Tool bi-directional turret for rapid on-the-fly tool changes
  • Pulse heat and steady state stages for eutectic attach
  • Flip chip (90° - 180°)
  • Waffle/Gel Pak, custom presentation stages
  • Eutectic die attach indexing conveyor with automatic substrate and part loading, standard edge belt conveyor
  • Up to 3 fluid dispensers (epoxy) capable for use with auger and time/pressure pumps
  • Epoxy daub/stamping
  • In-situ UV cure kit (stage and bond head versions available)
  • Motorized expanded wafer die ejectors
  • Tape feeders, tape and reel
  • Assembly line integration

Applications

  • AOC - Active Optical Cable
  • RF GaN/GaAs
  • RF packages HB/HP LED assembly
  • Microwave modules
  • Hybrid microcircuits
  • VCSEL, Photo Diode, DFB laser, and Lens attach
  • Solid State Lasers
  • MEMS
  • LED Printhead attachment
  • RF Power Amplifier
  • Solar concentrator packaging
  • MOEMS

Features

The 3880 Die Bonder utilizes a large work area, various presentation tools, steady state and pulsed heat system for eutectic bonding, high-accuracy motion system, multiple dispense technologies, die ejectors, and Cognex® Vision System. A sturdy mechanical structure, process camera, quiet linear motors, 0.1 micron linear XY encoders, and direct measure 0.00023 degree rotary encoder.

Download the 3880 Die Bonder Data Sheet

Download the 3880 Die Bonder Data Sheet

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Other Resources
Data Sheet White@2x.png Learn About Automated Eutectic Die Attach
Data Sheet White@2x.png Precision Fluid Dispense Solutions
Data Sheet White@2x.png Download the eBook Guide to Automated Production Lines
Data Sheet White@2x.png Learn more about Automated Flip Chip Assembly