This paper explores the die and wire bonding requirements of several device cases in RF, Microwave, High Brightness LED and Optoelectronic package formats when compared to mainstream Semiconductor Packaging.
The RF, Microwave, High Brightness LED, and Optoelectronic markets are characterized by lower volume and higher mix when compared to Semiconductor Packaging. This requires different levels of manual and automatic assembly process steps depending on product and manufacturing maturity. Suppliers can help customers through the various stages of manufacturing automation by providing manual, semi-automatic, and fully automatic islands and lines of equipment and process.
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