Resources

Palomar Technologies Whitepapers

Automating MEMS Assembly
Automated Eutectic Die Attach
Automated Ribbon Bonding
Contract SMT and Microelectronics Assembly in One
Equipment for Advanced Packaging
SMT and Microelectronic Assembly in One
The Great Debate: Ball vs. Wedge
High-Brightness Matrix LED: Assembly Challenges and Solutions
Optoelectronics Packaging: Building upon Integrated Circuit Manufacturing Expertise
Making the Connection with Wire Bonding
Ball in Corner - The Latest in Suspension Interconnect Technology
Automated Hybrid Assembly
Geometry and Bond Improvement for Wire Ball Bonding and Bumping
Gold Ball Bumping: An Effective Wafer Bumping Method
Gold Bump Technologies Plating versus Ball Bumping
Contract Manufacturers make strides in Active Components