3800 Die Bonder Overview
Palomar Technologies' ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated computer-controlled work cell performs up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.
Palomar Technologies' groundbreaking control architecture enables its user to apply precision motion control and process sequencing for a wide range of applications.
3800 Die Bonder Options
- Pulsed Heat System – high-precision eutectic die attach
- Steady State System
- Hot Rail Handler
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Component Placement Applications
| • AuSi eutectic scrub |
| • AuSn eutectic solder attach |
| • SnPb solder perform |
| • Anisotropic Conductive Paste (ACP) for flip chip attachment |
| • High-accuracy placement of optical components |
Features
The 3800 Die Bonder utilizes a large work area, various presentation tools, steady state and pulsed heat system for eutectic bonding, high-accuracy motion system, multiple dispense technologies, die ejectors and Cognex Vision System.
The 3800 Die Bonder features a newly-designed sturdy mechanical structure, process camera, quiet linear motors, 0.1 micron linear XY encoders and direct measure 0.00023 degree rotary encoder.
