3500-III Die Bonder
High-Accuracy Component Placement/Die Attach System

3500-III Die Bonder Overview

Palomar Technologies' 3500-III Die Bonder performs automated, high-accuracy die attach including adhesive dispense, pick-and-place component placement, eutectic die attach, flip chip operations and hybrid component assembly. It is designed for fully automatic, microelectronic assembly with 10µm typical placement accuracy (5µm under certain conditions).

The 3500-III Die Bonder is a stand-alone system that is well suited for a high-mix, low-volume production environment, and can easily be integrated for high-volume production by adding automated handling capabilities. It brings versatility, power and ease of use to microelectronics assembly.

3500-III Die Bonder Options

• Pulsed Heat System – high-precision eutectic die attach
• Steady State System
• Hot Rail Handler

Component Placement Applications

• AuSi eutectic scrub
• AuSn eutectic solder attach
• PbSn solder preform
• Anisotropic Conductive Paste (ACP) for flip chip attachment
• High-accuracy placement of optical components

Features

• 8-position tool turret—for rapid tool changes on the fly
• Automated eutectic die assembly—for high-volume, high-accuracy component placement
• Bond Data Miner™ (BDM) and RAM statistics—provides part traceability, predictive process capability, and monitors machine fitness
• Fully automated substrate and part loading—results in higher throughput and yields
• Linear encoders—increased accuracy and throughput, accurate and repeatable bond placement
• Very large work area (35”W x 20”D)—eliminates need to swap out between options, and accommodates both large and small microcircuit substrates and packages
• Precision eutectic control—applies heat at the temperature and length of time required for the application

Factory Integration