Gold Wire Bonding in Place of Ribbon
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spare-parts

Gold Wire Bonding in Place of Ribbon

Wire bonding RF devices with all ball bonds saves a machine transfer and setup time and possibly the purchase of another machine. Some active tuning is also possible by removing wires after completion.

Requirements: 8000i Wire Bonder

Specifications:
Wire =  1 mil (25.4 um) 99.99 Au  
Capillary = GAISER 1500 series  
Temperature = 150 C  
Picture magnification = x100  
Ball diameter = 75 um  
Ball height = not measured  
Shear strength = not tested  
Pitch = NA