Wire bonding RF devices with all ball bonds saves a machine transfer and setup time and possibly the purchase of another machine. Some active tuning is also possible by removing wires after completion.
Requirements: 8000 Wire Bonder
Specifications:
Wire = 1 mil (25.4 um) 99.99 Au
Capillary = GAISER 1500 series
Temperature = 150 C
Picture magnification = x100
Ball diameter = 75 um
Ball height = not measured
Shear strength = not tested
Pitch = NA
