Epoxy die attach is the most commonly used die attach process. In comparison to eutectic die attach, because of material costs and process, it is a more cost-effective solution. Applications used for epoxy die attach include simple transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids.
The Palomar Technologies 3800 Die Bonder has the ability to provide up to three channels of fluid dispense. This is very useful for applications requiring a high mix of parts and processes.
Epoxy Attach Dispensing Options
- Line Dispensing
- Dot Dispensing
- Time and pressure dispensing
