The fully automated 3800 Die Bonder offers its user the latest in design, mechanics, software and ergonomics.
Suited for complex applications such as:
- HB/HP LED Assembly
- Microwave Modules
- RF Power Amps
- Complex Hybrids
- Laser Diodes
- LED Printhead Attachment
With multiple options including pulsed heat and steady state stages for eutectic die attach applications, the 3800 Die Bonder meets the needs of the most unique and complex applications.