Upcoming Microelectronic Packaging Courses to be Held in Singapore

Posted by Katie Finney on Tue, Feb 04, 2014

CARLSBAD, CA – February 4, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced microelectronic packaging training courses to be presented by TJ Green Associates at the Palomar Technologies (SE Asia) Pte Ltd. facility in Singapore on February 24-28.

TJ Green Associates LLC is once again proud to present an entire week of public courses as part of the 2014 Singapore training event. Based on their success from last year, TJ Green Associates LLC will again conduct professional state of the art training classes focused on microelectronics packaging in Singapore. Train with TJ Green LLC during the day, and enjoy Singapore skylinethe beautiful city of Singapore at night. The Singapore Course Outlines & Registration Form can be found here.

The course offerings include:

Process Certification For Hybrids, Microcircuits and RF Microwave Modules
Monday Feb 24 - Wednesday Feb 26, 2014

This process certification training is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of the materials and processes used to assemble Hybrids, Microcircuits and RF Microwave Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straight-forward and easy to understand format. This fast-paced condensed 3 day course emphasizes the inspection criteria along die bond, wire bond, hermetic seal and testing and associated good manufacturing practices.

Wire Bonding Theory & DOE (Design of Experiments)
Thursday Feb 27, 2014
This is an intense one day course that covers the theory and practical aspects of forming a wire bond interconnect. Special emphasis is placed on the materials, processes and statisticalwire bond interconnect, wire bond, Tom Green microelectronics training courses methods used to optimize process yields. The necessary steps to properly conduct a controlled DOE to optimize the wire bond parameter settings along with actual DOE case studies will be reviewed and discussed in detail as the instructor shares his personal experience with performing wire bond DOEs in a classroom setting.

Pre Cap Visual Inspection Per Mil-Std-883
Friday Feb 28, 2014
Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree ofIC chip, Tom Green microelectronics packaging courses, wire bond interconnect, wire bond skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices.

About TJ Green Associates
TJ Green Associates LLC  provides teaching and consulting services to companies around the world with expertise in hermeticity, materials and processes used to assemble hybrids, microcircuits, multichip modules, RF/MMIC microwave modules, MEMS, Class III medical implants, optoelectronics, and other types of packaged microcircuits.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Janine Hueners
Marketing Specialist
Palomar Technologies, Inc.
jhueners@bonders.com | +1 760-931-3680

Tags: Announcements, wire bonding, Palomar Asia, training

Wire Bonding & Stud Bumping Technical Track Plus New Product Demos at IMAPS 2013

Posted by Katie Finney on Tue, Sep 24, 2013

Carlsbad, CA – September 24, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced new product demos at IMAPS 2013. The 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) will be showcased through live demonstrations in booth #511 on October 1-2 at the Rosen Centre Hotel in Orlando, FL.

Wire Bonding & Stud Bumping Technical Track
Dan Evans (Palomar Technologies Senior Scientist) and Lee Levine (Process Solutions Consulting) will co-chair the Wire Bonding and Stud Bumping technical track. This session track covers non-destructive testing challenges and methods of wires and bond pads, Pd-coated Cu wire process window optimization, Cu wedge bonding, Al and Ag based wires as alternatives to copper, plus hybrid wire bond capabilities. Evans and David Rasmussen (Palomar Technologies Assembly Services™ General Manager) will present “Multipurpose Wire Bonding - Bumps, Wires, Combination Interconnects, and Operation Efficiency” at 4:30 PM - 4:55 PM on Tuesday, October 1.

Test Drive New Wire Bonding Software at IMAPS 2013 

IMAPS 2013 attendees are able to test drive i2Gi (cleverly pronounced “iggy”) in booth #511 throughout the duration of the exhibit hall. i2Gi is implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. 

i2Gi demo 

i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

i2Gi, intelligent interactive graphical interface, modern wire bond control software

8000i wire bonder, ball bumper, i2Gi

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.  

The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

See i2Gi in Action

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Jessica Sylvester
Marketing Communications Manager
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681

Tags: Announcements, wire bonding, 8000i Wire Bonder, i2Gi, Bonder Performance Upgrade (BPU), 8000 wire bonder

Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

Posted by Rich Hueners on Wed, May 02, 2012

Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.

Palomar Technologies will exhibit in Hall 6 Booth #433 and will showcase an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.

The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

Mr. Josef Schmidl, director of Palomar Technologies Europe located in Erlangen, Germany, will be attending SMT Nuremberg and is available during the conference for any on-site meetings.

Mr. Dale Perry, Regional Manager of the Eastern North/South Americas, will also attend SMT Nuremberg. Mr. Perry is available during the duration of the conference to discuss Palomar Technologies Assembly ServicesTM capabilities and solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: wire bonder, wire bonding, bonders, wire bonders, capital equipment, ball bumping, semiconductor vs. hybrid, Eastern Europe, ball-bumping process, 8000 wire bonder, wire bond testing, Palomar Europe, Royce Instruments, wire bond demo, Contract Assembly in Europe, palomar 8000, SMT

Palomar Technologies 3800 Die Bonder Offers Flexible Solutions to Support LED Development in China

Posted by Rich Hueners on Tue, Mar 13, 2012

Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.

Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.

Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.

“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”

Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.

In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: 3800 die bonder, wire bonder, wire bonds, wire bonding, LED matrix assembly, LED applications, wire bonders, capital equipment, LED packaging, wafer scale packaging, automated component placement systems, automated packaging systems, Hybond, 8000 wire bonder, 6500 die bonder, automation vs. manual, field services support, Bonder Boot Camp, made in china, SEMICON China, wire bond testing

Palomar Technologies Exhibits at SEMICON Taiwan 2011 and Offers a Laser Interferometer Technology for Wire Bonder Ultrasonic Calibration System

Posted by Rich Hueners on Thu, Sep 01, 2011

Carlsbad, CA – August 31, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth #1006.

The Palomar Technologies Asia-Pacific team has joined forces with Supremetec Materials, Inc. to offer the latest in high-accuracy die bonders and wire bonder systems at this year’s tradeshow. Mr. PH Chan, Palomar Technologies’ Asia-Pacific Director, will be on-site to discuss the latest advancements in systems and process development from Palomar Technologies.

“In order to ensure a seamless transfer of equipment, the Palomar Technologies Asian field services team works closely with customers to cover proper planning, coordination and scheduling. Our customers experience a ‘plug and play’ when the die bonders arrive at their Asian facilities,” states Chan. “Most of our Asian customers who previously deployed 3500 Die Bonders have now entered the second phase of their expansion in production capacity by purchasing new equipment. We have seen an increase in customers’ decision to switch over to the ultra-flexible 3800 Die Bonder to meet new and more challenging packages, such as those requiring 5-7um placement accuracy at 3-sigma.”

Palomar Technologies combines more than 30 years of process know-how with a high-precision line of machines to ensure their bonders maintain production at peak performance. The 2100C Laser Interferometer provides a non-contact method to check the performance of a wire bonder’s ultrasonic system through laser interferometer technology. Without calibration, a wire bonder will suffer process inconsistencies. The 2100C makes this calibration an efficient and user-friendly action.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Carlsbad, CA,2011/9/1, Palomar是世界頂尖微機電與光電封裝系統的服務提供者,今日宣布將參加2011台灣半導體展,從9/7到9/9,攤位號碼1006。

Palomar亞洲區營運總部與台灣Supremetec Materials, Inc今年一起在台灣介紹最新高精密度黏晶機與打線機。Palomar亞洲總监-PH Chan將會於現場就Palomar機器討論最新進展與產品開發流程。

PH說 “為了確保儀器運轉順利,Palomar亞洲營運總部與客戶之間緊密的配合與合作。當黏晶機設備抵達亞洲時,我們的客戶體驗到了所謂的隨插即用的簡單方便性。大多數於亞洲擁有機型3500 黏晶機的客戶,目前都進入了下個擴展階段要購買新儀器。我們發現增加了很多客戶要決定換購多功能的超高弾性機型3800的黏晶機,以便符合產品的多元性封裝挑戰,像是具備在3-sigma下達到5~7 um的放置精確度。”

Palomar Technologies 以30年的工艺經驗配合了各種高精密度設備,使公司所提供的黏晶機與打線機運作的更加完美。2100C Laser Interferometer雷射機透過雷射技術提供非接觸性技術來檢測打線機的超音波系統性能,該方法藉計算干擾邊線方式精確量測過實際超音波軌跡。 未經過校正的打線機會面臨一連串的不協調問題。2100C會讓這校正更有效率與操作上容易使用。

關於Palomar Technologies

Palomar Technologies 前身是休斯航太,是世界上頂尖提供自動化高精密度,大工作區域黏晶機與打線機的服務廠商。顧客使用Palomar的機器,服務與方法來達成對光電產品的封裝,多種類的組裝與微機電種類的貼合。相關更多資訊請參閱www.palomartechnologies.com

Tags: 3800 die bonder, wire bonding, trade shows, wire bonders, 3500 Die Bonder, 2100C, semicon taiwan, wire bond calibration

Palomar Technologies to Exhibit at IMAPS Device Packaging and Shares Prominent Technical Papers for Download

Posted by Rich Hueners on Fri, Mar 04, 2011

CARLSBAD, CA - March 4, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the IMAPS Device Packaging conference on March 8-9 in Scottsdale, AZ.

Account manager for Western North America, Bradley Benton, will be on site at the IMAPS Device Packaging conference at booth #16. To ensure an in-person meeting with Mr. Benton, register with IMAPS for a free admission pass to the Device Packaging exhibitors' show floor.

Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Improved Wire Bond Reliability, a white paper providing an in-depth look at the significantly improved integrity of a wire bond interconnect through the proper use of auxiliary wires, such as stand-off stitch wire bonding.

"We value knowledge sharing and partnering with our customers," states Daniel Evans, Palomar Technologies senior scientist. "By having a deep understanding of our equipment as applied across a wide variety of applications we can leverage this experience to enable our current and future customers to make educated process development decisions when working with our die and wire bonding engineers."

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: wire bonder, wire bonds, wire bonding, gold ball bumping, gold ball bonder, wire bonders, ball bumping, ball bump, IMAPS Device Packagin

Wire Bonding Company, Palomar Technologies, Forms Alliances With GPD Global, Royce Instruments and Hybond

Posted by Rich Hueners on Thu, Apr 23, 2009

CARLSBAD, CA - April 22, 2009 - Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging and experts in precision wire bonding, gold wire bond and high accuracy component placement systems, announced today it has formed alliances with GPD Global, Hybond, Inc., and Royce Instruments, Inc.

"The systems that these firms provide are very complementary to our precision wire bonding, automatic wire bonders and die bonders," said Bruce W. Hueners, President and CEO of Palomar Technologies. "These alliances will enable us to offer our worldwide customer base the most comprehensive options available, and truly make Palomar the 'one-stop-solution-shop' for microelectronic and optoelectronic packaging solutions."

GPD Global, headquartered in Grand Junction, CO, is a premier manufacturer of automated precision fluid dispensing systems. "We are excited about our new relationship with Palomar. With this alliance, our advanced precision dispense systems are now available as part of a complete microelectronics assembly line," said Sven Wedekin, Vice-President and General Manager of GPD Global.

Hybond, Inc., based in Escondido, CA, is a world-renowned designer and manufacturer of manual wire bonders, die bonders and wedge bonders. Since 1980, Hybond products have been instrumental in microelectronics development and production. Felix Mayorca, Vice-President of Sales and Marketing, said, "It's a natural alliance... wherever you see a Palomar system you could also see a Hybond system."

Royce Instruments, Inc., located in Napa, CA, is an industry leader in bond testers and die sorters. The company provides compact bond testers with built-in SPC and networking, and versatile, low cost die sorters. Diane Cox, President, said, "With a 25 year record of innovation and excellent customer support, Royce Instruments looks forward to a fruitful and dynamic collaboration with Palomar."

About Palomar Technologies
Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of high-precision wire bonders, gold wire bonders, die bonders and automated component placement systems. Palomar combines process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers in the telecommunications, medical, defense and aerospace and commercial high technology industries. For more information, visit www.palomartechnologies.com.

Tags: wire bonder, wire bonds, wire bonding, bonders, wire bonders, Factory Automation, Hybond, Royce Instruments, GPD Global