Palomar Technologies to Exhibit at SEMICON China in Shanghai

Posted by Janine Powell on Wed, Mar 08, 2017

Carlsbad, CA—March 8, 2017—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON China at the Shanghai New International Expo Centre in Shanghai on March 14-16 in booth #4543. Be First Technology Co. Ltd will be representing Palomar at the show, alongside some key members of the Palomar and SST Vacuum Reflow Systems teams. The 3880 Die Bonder, as well as the SST 5100 Vacuum Pressure Furnace will be showcased at the booth; SST will also be launching a new product at the show.

Talk With Palomar About Die Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bondhead design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput.

Palomar shoot 1 3880 wTech.png
SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON China will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and assembly products. A critical feature of SST’s unique position is its expertise in designing and 5100.pngmachining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding. The Model 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. Be sure to stop by the booth to see this system live, along with their newest product addition.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SST Vacuum Reflow Systems
SST Vacuum Reflow Systems is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

###                                                                                                  

APAC Contact
Mr. PH Chan
Director of North Asia Sales
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096

Media Contact
Katie Schirmer
Marketing Communications Manager
Palomar Technologies, Inc.
kschirmer@bonders.com | +1 760.931.3680

Tags: Announcements, trade shows, SEMICON China, SST Vacuum Reflow Systems

Palomar Technologies to Present and Exhibit at IMAPS 2016

Posted by Katie Finney on Tue, Oct 04, 2016

Carlsbad, CA – October 4, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be presenting a technical paper and exhibiting at the IMAPS 49th International Symposium on Microelectronics in Pasadena, CA being held on October 10-13, 2016 in booth #702.

Palomar Technologies’ Chief Technical Officer, Dan Evans, will present the paper “Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging” on Thursday, October 13th at 10:30am. This paper will provide a survey of RF and optoelectronic packages, and the common wire and ribbon bond requirements. It will also survey the packaging challenges and solutions available to process engineers. Collaborations between manufacturer and equipment supplier with helpful tips leveraging each other’s strengths to transition from concept to production will also be discussed.

In addition, SST Vacuum Reflow Systems, as part of Palomar Technologies total solutions for eutectic die bonding and advanced packaging systems, will present their technical paper “Achieving Low Voiding with Lead Free Solder Paste for Power Devices”, and will be performing live demos of their 5100 Vacuum Pressure Furnace. SST’s Process Development Engineer, Pierino Zappella, will present this paper on Thursday, October 13th at 1:00pm. The processes discussed in this session will show how low void levels can be achieved while using solder paste on different materials in a vacuum reflow oven.

Don’t forget to also stop by booth 702 during the Palomar Technologies sponsored Dessert Happy Hour and during the exhibition to learn more about Palomar Technologies and SST Vacuum Reflow Systems.

IMAPS_Pasadena_2016.jpg

###

Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, IMAPS, IMAPS 2016

Wedge and Die Bond Demos at SEMICON West 2016

Posted by Janine Powell on Wed, Jul 06, 2016

Carlsbad, CA – July 6, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at SEMICON West 2016. The 9000 Wedge Bonder, 3880 Die Bonder, and SST 5100 with QuikCool™ system will be showcased through live demonstrations in booth #5952 on July 12-14 at the Moscone Center in San Francisco, CA.

Test Drive the New 3880 Die Bonder at SEMICON West 2016
Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.

Palomar_shoot_1_Tool_Arm_detail.png

In the early 1990s, Palomar developed the “tool turret” design which has become standard on all of our die bonders. This tool turret is outfitted with 8 tools and designed for customers who require maximum flexibility while maintaining throughput and yield. We designed the 3880 Die Bonder by keeping the tool turret idea and maintaining 8 tools. Several new features were added to improve capabilityspeedservice reliabilityease of operation, and cost-of-ownership.

Automated High-Speed Fine Wire Wedge & Ribbon Bonder Demos
Along with the 3880 Die Bonder, attendees at the show will be able to view a full application demo of the 9000 Wedge Bonder with inline handlers using i2Gi®: Intelligent Interactive Graphical Interface®.  The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head.

9000_wHandlers.png

SST Vacuum Reflow Systems Announce New QuikCool Auxiliary Cooling System
Also on exhibit in the Palomar Technologies booth will be SST’s new auxiliary cooling system option for their Model 5100 Vacuum Pressure Furnace. The New_QK_B.pngQuikCool system was a response to customers who wanted to know how they could increase batch production throughput, thus reducing costs and increasing the volume of units produced. By quickly reducing the chamber’s temperature after reflow, process cycle time is reduced, thus allowing more production cycles per hour.

Be sure to stop by the booth if you are visiting SEMICON West, check out a demo, and speak with our experts about your application challenges.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, SST Vacuum Reflow Systems, SEMICON West 2016

Palomar Technologies to Exhibit at SEMICON Southeast Asia and SMT Nuremberg

Posted by Rich Hueners on Tue, Apr 19, 2016

Carlsbad, CA—April 19, 2016—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON Southeast Asia at the SPICE Arena in Penang, Malaysia on April 26-28 in booth #209. They will also be exhibiting at SMT Hybrid Packaging in Nuremberg, Germany on April 26-28 in booth 7A-205.

Palomar made several noteworthy announcements in 2015, including the launch of its new 3880 ultra-flexible die bonder and its acquisition of SST International.

Talk With Palomar About Die and Wedge Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bond 3880_bondhead.pnghead design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput. Also new to the Palomar suite of solutions is the 9000 Fine Wire Wedge Bonder. Devised and designed for modern wedge bonding, the 9000 uses a voice coil driven bond head with interchangeable clamps for 45-60° and 90° feed angles. Customers doing ribbon bonding benefit from being able to use the same clamp with ribbon as they do with round wire. Because the bond head itself turns on a single mechanism, there is no twisting of ribbon or wire during the bonding process. The feed path is shorter, the control better, and the precision of wedge bonding greatly improved.    

SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON Southeast Asia will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and SST-graphite_tooling.jpgassembly products. A critical feature of SST’s unique position is its expertise in designing and machining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding.

Palomar Technologies GmbH will also be exhibiting at SMT Hybrid Packaging next week in Nuremberg, Germany. The 9000 Wedge Bonder will be on display, as well as SST's 5100 Vacuum Pressure Furnace. They would love to speak with you at the show about packaging challenges and possible solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

###                                                                                                  

APAC Contact
Mr. PH Chan
General Manager, Asia Pacific
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096

EMEA Contact
Mr. Josef Schmidl
Managing Director, Europe
Palomar Technologies GmbH | 49 (9131) 48009-30

Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Announcements, trade shows, SEMICON Southeast Asia, SMT Nuremberg

Palomar Technologies gibt die Teilnahme an der Productronica 2011 bekannt und stellt Large Work Area Wire- u. Die Bonder vor

Posted by Rich Hueners on Tue, Nov 08, 2011

Carlsbad, CA –  8 November 2011 – Palomar Technologies gibt heute ihre Teilnahme an der Productronica in München vom 15.-18.November 2011 bekannt.

Sie finden den weltweit führenden Hersteller für vollautomatische und hochpräzise Fertigungsanlagen (Wire- und Diebonder) in Halle B2, Stand 315.

Die Anlagen von Palomar kommen für die verschiedensten Anwendungen in der Hybrid- und Halbleiterindustrie zum Einsatz.

“Palomar Technologies hat eine jahrzehntelange Erfahrung und anerkannte Fachkompetenz in den Bereichen Entwicklung, Konstruktion, Automatisierung und Meßtechnik auch für schwierigste Applikationen in der Wire- und Bestückungstechnologie“, sagte Josef Schmidl, Geschäftsführer der Palomar Technologies GmbH. “Unsere Modelle 8000 Wire Bonder sowie  3800 Die Bonder repräsentieren heute den neuesten Stand in der Wire-/ Diebond Technik. Zu den einzigartigen Maschinenkonzepten mit seinen hervorragenden Meß- u. Regelsystem, ermöglichen benutzerfreundliche Softwarelösungen eine einfache Bedienung und sind auch in Bezug auf Durchsatz und Flexibilität konkurrenzlos.”

Das Modell 8000 Wire Bonder, bietet enorme Einsatzflexibilität wie z.B. Deep Access bis zu 19.05mm Bondtiefe, Verwendung von In-Line Magazinsystemen, Erzeugung absolut flacher Stud Bumps (kein Tail), Stand-off-Stitch wires (Plazierung eines Bumps vor dem Draht) und vieles mehr. Bei einer Bondgeschwindigkeit von bis zu 0.125s/ Draht (0.077s/ Bump) und einer Gesamtgenauigkeit von ±2.5µ, 3Sigma, erzielt der 8000 Ballbonder höchste Erträge und wird daher für die Verarbeitung hochkomplexer Hybride, MCM’s usw. eingestzt.

Das Model 3800 Die Bonder ist ein vollautomatisches, extrem flexibles Pick and Place System mit einer Plaziergenauigkeit von ±7µ und einer Wiederholgenauigkeit von 3.5µ, bei 3sigma.

Der Diebonder wurde kürzlich mit dem 2011 New Product Introduction Award für seine Leistungsfähigkeit und Einsatzflexibilität ausgezeichnet, da mit ihm auch Prozesse wie eutektisches AuSi/ AuSn Löten durchgeführt werden können.

Zurzeit läuft eine Umtausch-/ Rücknahme Aktion des bewährten Vorgängermodells 3500-III gegen den Kauf eines neuen Modells 3800 (Palomar Technologies’ Bonder Buy-Back Program).

Palomar Technologies

Palomar Technologies, ein früheres Tochterunternehmen von Hughes Aircraft, ist der weltweit führende Hersteller von vollautomatischen, hochpräzisen Large Area Die- u. Wirebonder sowie Anbieter von Dienstleistungen (Produkt-/ Prozessentwicklung, Fertigung) in diesen Bereichen.

Kunden setzen die Systeme und Dienstleistungen von Palomar Technologies ein um den heutigen komplexen Anforderungen in der Mikroelektronikfertigung gerecht zu werden.

Weitere Informationen finden Sie bitte auf der Website www.palomartechnologies.com.

###

Kontakt Palomar Technologies GmbH (Europe)
Josef Schmidl
Managing Director, Palomar Technologies GmbH
jschmidl@palomartechnologies.de | 49-9131-48009-30                                      

----

Carlsbad, CA – November 8, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit in Hall B2, Booth 315 at Productronica 2011, held in Munich, Germany on November 15-18.

“Palomar Technologies has a long-standing presence as an industry expert in design, engineering, automation and metrology for even the most complex component placement and wire bonding applications,” said Josef Schmidl, managing director of Palomar Technologies GmbH. “Our 8000 Wire Bonder and 3800 Die Bonder  represent the latest advances in wire- and die bonding technology, incorporating leading-edge mechanical design, control architecture and user-friendly GUI to provide the highest net throughput and flexibility of any comparable tool on the market today.”

The 8000 Wire Bonder offers tremendous versatility with capabilities including deep access wire bonding of 11.10 to 19.05mm, automated in-line and magazine handlers, tailless bump mode and improved reliability with stand-off stitch wires. With cycle times up to 0.125 sec/wire and 0.077 sec/bump, and a placement accuracy of +/- 2.5 micron, 3 sigma, the overall precision of the 8000 Wire Bonder results in high-yield processing of fine-pitch high wire count applications and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

The 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies’ Bonder Buy-Back Program.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Tags: 3800 die bonder, trade shows, bonder buying options, 8000 wire bonder, productronica, Bonder Buy Back Program, AuSn

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011

Posted by Rich Hueners on Tue, Oct 04, 2011

Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.

Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.

“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”

Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.

Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Tags: 3800 die bonder, LED matrix assembly, trade shows, 8000 wire bonder, IMAPS, HB LED, AuSn, hi-rel wire bonds

Palomar Technologies Exhibits at SEMICON Taiwan 2011 and Offers a Laser Interferometer Technology for Wire Bonder Ultrasonic Calibration System

Posted by Rich Hueners on Wed, Aug 31, 2011

Carlsbad, CA – August 31, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth #1006.

The Palomar Technologies Asia-Pacific team has joined forces with Supremetec Materials, Inc. to offer the latest in high-accuracy die bonders and wire bonder systems at this year’s tradeshow. Mr. PH Chan, Palomar Technologies’ Asia-Pacific Director, will be on-site to discuss the latest advancements in systems and process development from Palomar Technologies.

“In order to ensure a seamless transfer of equipment, the Palomar Technologies Asian field services team works closely with customers to cover proper planning, coordination and scheduling. Our customers experience a ‘plug and play’ when the die bonders arrive at their Asian facilities,” states Chan. “Most of our Asian customers who previously deployed 3500 Die Bonders have now entered the second phase of their expansion in production capacity by purchasing new equipment. We have seen an increase in customers’ decision to switch over to the ultra-flexible 3800 Die Bonder to meet new and more challenging packages, such as those requiring 5-7um placement accuracy at 3-sigma.”

Palomar Technologies combines more than 30 years of process know-how with a high-precision line of machines to ensure their bonders maintain production at peak performance. The 2100C Laser Interferometer provides a non-contact method to check the performance of a wire bonder’s ultrasonic system through laser interferometer technology. Without calibration, a wire bonder will suffer process inconsistencies. The 2100C makes this calibration an efficient and user-friendly action.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

###

Carlsbad, CA,2011/9/1, Palomar是世界頂尖微機電與光電封裝系統的服務提供者,今日宣布將參加2011台灣半導體展,從9/7到9/9,攤位號碼1006。

Palomar亞洲區營運總部與台灣Supremetec Materials, Inc今年一起在台灣介紹最新高精密度黏晶機與打線機。Palomar亞洲總监-PH Chan將會於現場就Palomar機器討論最新進展與產品開發流程。

PH說 “為了確保儀器運轉順利,Palomar亞洲營運總部與客戶之間緊密的配合與合作。當黏晶機設備抵達亞洲時,我們的客戶體驗到了所謂的隨插即用的簡單方便性。大多數於亞洲擁有機型3500 黏晶機的客戶,目前都進入了下個擴展階段要購買新儀器。我們發現增加了很多客戶要決定換購多功能的超高弾性機型3800的黏晶機,以便符合產品的多元性封裝挑戰,像是具備在3-sigma下達到5~7 um的放置精確度。”

Palomar Technologies 以30年的工艺經驗配合了各種高精密度設備,使公司所提供的黏晶機與打線機運作的更加完美。2100C Laser Interferometer雷射機透過雷射技術提供非接觸性技術來檢測打線機的超音波系統性能,該方法藉計算干擾邊線方式精確量測過實際超音波軌跡。 未經過校正的打線機會面臨一連串的不協調問題。2100C會讓這校正更有效率與操作上容易使用。

關於Palomar Technologies

Palomar Technologies 前身是休斯航太,是世界上頂尖提供自動化高精密度,大工作區域黏晶機與打線機的服務廠商。顧客使用Palomar的機器,服務與方法來達成對光電產品的封裝,多種類的組裝與微機電種類的貼合。相關更多資訊請參閱www.palomartechnologies.com

Tags: 3800 die bonder, wire bonding, trade shows, wire bonders, 3500 Die Bonder, 2100C, semicon taiwan, wire bond calibration